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Proceedings Paper

Technology for low-lost and high-volume optical device packaging
Author(s): Kazuhiko Kurata; Nobuharu Kami; Kazunori Miyoshi; Takara Sugimoto; Kei Tanaka; Satoshi Dhomae
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Paper Abstract

Hybrid integration of optical and electrical components (opt-electronic hybrid integration) leads to great progress in low cost and high volume optical packaging. We have developed various types of opt-electronic hybrid integration Tx/Rx module. Recently, demand for transmission speed is increasing up to 10 Gbps in Metro, LAN networks. A new packaging technique is now requested to realize lower cost and high speed. This paper presents the advance of the opt-electronic hybrid integration technology. A new packaging platform is proposed after revealing the present opt-electronic hybrid integration Tx/Rx module, and the prototype 10G-Ether modules are introduced as a trial

Paper Details

Date Published: 11 July 2002
PDF: 9 pages
Proc. SPIE 4870, Active and Passive Optical Components for WDM Communications II, (11 July 2002); doi: 10.1117/12.475561
Show Author Affiliations
Kazuhiko Kurata, NEC Corp. (Japan)
Nobuharu Kami, NEC Corp. (Japan)
Kazunori Miyoshi, NEC Corp. (Japan)
Takara Sugimoto, NEC Corp. (Japan)
Kei Tanaka, NEC Corp. (Japan)
Satoshi Dhomae, NEC Corp. (Japan)

Published in SPIE Proceedings Vol. 4870:
Active and Passive Optical Components for WDM Communications II
Achyut Kumar Dutta; Abdul Ahad Sami Awwal; Niloy K. Dutta; Katsunari Okamoto, Editor(s)

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