Share Email Print
cover

Proceedings Paper

Optical components and their packaging/module trends for WDM communication
Author(s): Achyut Kumar Dutta; Masahiro Kobayashi
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The application area of optical communication is expanding from trunk lines to subscriber loops, and local area networks (LAN). Optical components and their packaging technology also vary based on different application area. This paper describes the trends of key optical components and their packaging/module technologies for WDM application. The state-of-the art of technologies for 10Gb/s and 40Gb/s application are also included. Finally, future, module technologies will also be addressed.

Paper Details

Date Published: 11 July 2002
PDF: 12 pages
Proc. SPIE 4870, Active and Passive Optical Components for WDM Communications II, (11 July 2002); doi: 10.1117/12.475560
Show Author Affiliations
Achyut Kumar Dutta, Fujitsu Compound Semiconductor Inc. (United States)
Masahiro Kobayashi, Fujitsu Quantum Devices Ltd. (Japan)


Published in SPIE Proceedings Vol. 4870:
Active and Passive Optical Components for WDM Communications II
Achyut Kumar Dutta; Abdul Ahad Sami Awwal; Niloy K. Dutta; Katsunari Okamoto, Editor(s)

© SPIE. Terms of Use
Back to Top