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Proceedings Paper

Active interposer technology for high-speed and low-cost chip-to-chip optical interconnects
Author(s): Takashi Mikawa; Osamu Ibaragi; Manabu Bonkohara
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Paper Details

Date Published: 11 July 2002
PDF: 7 pages
Proc. SPIE 4870, Active and Passive Optical Components for WDM Communications II, (11 July 2002); doi: 10.1117/12.475557
Show Author Affiliations
Takashi Mikawa, Association of Super-Advanced Electronics Technologies (Japan)
Osamu Ibaragi, Association of Super-Advanced Electronics Technologies (Japan)
Manabu Bonkohara, Association of Super-Advanced Electronics Technologies (Japan)


Published in SPIE Proceedings Vol. 4870:
Active and Passive Optical Components for WDM Communications II
Achyut Kumar Dutta; Abdul Ahad Sami Awwal; Niloy K. Dutta; Katsunari Okamoto, Editor(s)

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