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Proceedings Paper

High-precision die bonding for photonics packaging
Author(s): Scott Trask; Khushwant Singh; Daniel F. Crowley; Peter Cronin
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Paper Details

Date Published: 30 May 2003
PDF: 7 pages
Proc. SPIE 4997, Photonics Packaging and Integration III, (30 May 2003); doi: 10.1117/12.475483
Show Author Affiliations
Scott Trask, Newport Corp. (United States)
Khushwant Singh, Newport Corp. (United States)
Daniel F. Crowley, Newport MRSI (United States)
Peter Cronin, Newport MRSI (United States)


Published in SPIE Proceedings Vol. 4997:
Photonics Packaging and Integration III
Randy A. Heyler; David J. Robbins; Ghassan E. Jabbour, Editor(s)

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