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Proceedings Paper

High-precision die bonding for photonics packaging
Author(s): Scott Trask; Khushwant Singh; Daniel F. Crowley; Peter Cronin
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Paper Abstract

Photonics packaging applications require significantly higher precision die bonding processes than traditional electronics and RF/microwave devices. Die placement accuracy of microns and better has been demonstrated. Key factors affecting the capability ofplacing die at accuracies of 5microns in photonics packaging are discussed. Factors that enable high accuracy die bonding range from machine platform design to a combination ofprocess parameters. Another key factor in die bonding placement accuracy is the quality of visual reference points or fiducials on the die, substrate, or surrounding package. Examples ofgood and poor visual references are shown and a discussion ofdie and package design is presented. A method ofplacement accuracy validation and a discussion ofhigh accuracy die bonding applications are presented.

Paper Details

Date Published: 30 May 2003
PDF: 7 pages
Proc. SPIE 4997, Photonics Packaging and Integration III, (30 May 2003); doi: 10.1117/12.475483
Show Author Affiliations
Scott Trask, Newport Corp. (United States)
Khushwant Singh, Newport Corp. (United States)
Daniel F. Crowley, Newport MRSI (United States)
Peter Cronin, Newport MRSI (United States)


Published in SPIE Proceedings Vol. 4997:
Photonics Packaging and Integration III
Randy A. Heyler; David J. Robbins; Ghassan E. Jabbour, Editor(s)

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