Share Email Print
cover

Proceedings Paper

Thermomechanical optimization of thermally actuated cantilever arrays
Author(s): David Bullen; Ming Zhang; Chang Liu
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Scanning probe lithography (SPL) is an emerging method of producing sub 50-nm features for semiconductor applications. A new variation of this process known as Dip Pen Nanolithography (DPN) expands the range of SPL capabilities to include depositing organic and biological macromolecules with nanometer precision. Recent work has been underway to implement DPN as parallel process by employing close packed arrays of individually thermally actuated DPN probes (TA-DPN arrays). In these types of devices, it is not necessary to have feedback control of the height of individual tips during operation. This simplifies the control system and probe structure but complicates array design because of the uncontrolled mechanical interaction between the tip and surface. We have found that TA-DPN arrays are subject to several failure modes that make optimization difficult, including surface scratching, excess tip angle, and problems resulting from inadequate actuation. In this paper, these performance issues are outlined and resolved with the creation of a multi-parameter simulator. The simulation predicts array behavior by employing engineering beam theory, Hertz contact mechanics, and capillary adhesion theory. Using the new insights gained from this simulation method, TA-DPN arrays can be quickly optimized based on any desired criteria.

Paper Details

Date Published: 11 July 2002
PDF: 8 pages
Proc. SPIE 4700, Smart Structures and Materials 2002: Smart Electronics, MEMS, and Nanotechnology, (11 July 2002); doi: 10.1117/12.475042
Show Author Affiliations
David Bullen, Univ. of Illinois/Urbana-Champaign (United States)
Ming Zhang, Univ. of Illinois/Urbana-Champaign (United States)
Chang Liu, Univ. of Illinois/Urbana-Champaign (United States)


Published in SPIE Proceedings Vol. 4700:
Smart Structures and Materials 2002: Smart Electronics, MEMS, and Nanotechnology
Vijay K. Varadan, Editor(s)

© SPIE. Terms of Use
Back to Top