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Proceedings Paper

Vacuum packaging of microresonators by rapid thermal processing
Author(s): Mu Chiao; Liwei Lin
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Paper Abstract

Vacuum packaging of micro resonators using TRP aluminum-to- nitride bonding has been demonstrated. Polysilicon micro resonators are fabricated with integrated sealing rings using surface micromachining technology. The top most layer on the sealing ring is silicon nitride. Aluminum sealing rings are patterned on the Pyrex glass cap wafers. The bonding and sealing of device wafer to cap wafer is done by heating the wafers in the RTP chamber at 750 degrees C for 10 seconds in vacuum. The quality factor of a vacuum- packaged micro resonator is measured as 400 +/- 50.

Paper Details

Date Published: 11 July 2002
PDF: 5 pages
Proc. SPIE 4700, Smart Structures and Materials 2002: Smart Electronics, MEMS, and Nanotechnology, (11 July 2002); doi: 10.1117/12.475039
Show Author Affiliations
Mu Chiao, Univ. of California/Berkeley (United States)
Liwei Lin, Univ. of California/Berkeley (United States)


Published in SPIE Proceedings Vol. 4700:
Smart Structures and Materials 2002: Smart Electronics, MEMS, and Nanotechnology
Vijay K. Varadan, Editor(s)

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