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Proceedings Paper

Novel technique for fabrication of multilayered microcoils in microelectromechanical systems (MEMS) applications
Author(s): Hung-Pin Chang; Jiangyuan Qian; Mark Bachman; Philip Congdon; Guann-pyng Li
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Paper Abstract

A novel planarization technique, compressive molding planarization (CMP) is developed for implementation of a multi-layered micro coil device. Applying CMP and other micromachining techniques, a multi-layered micro coil device has been designed and fabricated, and its use in the magnetic micro actuators for hard disk drive applications has been demonstrated, showing that it can produce milli-Newton of magnetic force suitable for driving a micro actuator. The novel CMP technique can be equally applicable in other MEMS devices fabrication to ease the process integration for the complicated structure.

Paper Details

Date Published: 11 July 2002
PDF: 9 pages
Proc. SPIE 4700, Smart Structures and Materials 2002: Smart Electronics, MEMS, and Nanotechnology, (11 July 2002); doi: 10.1117/12.475030
Show Author Affiliations
Hung-Pin Chang, Univ. of California/Irvine (United States)
Jiangyuan Qian, Univ. of California/Irvine (China)
Mark Bachman, Univ. of California/Irvine (United States)
Philip Congdon, Texas Instruments Inc. (United States)
Guann-pyng Li, Univ. of California/Irvine (United States)


Published in SPIE Proceedings Vol. 4700:
Smart Structures and Materials 2002: Smart Electronics, MEMS, and Nanotechnology
Vijay K. Varadan, Editor(s)

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