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Proceedings Paper

Advances in utilization of structurally integrated sensor networks for health monitoring in commercial applications
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Paper Abstract

Structural health monitoring is a new technology that has been increasingly evaluated by the industry as a potential approach to improve the cost and ease of structural inspection. By improving structural inspection, structures can be made safer and more reliable, thus reducing the cost of structure ownership. Acellent Technologies is developing tools for structural health monitoring. The tools Acellent is offering are the SMART Layer and the SMART Suitcase. The SMART Layer is a flexible layer with a distributed array of piezoelectric transducers made using the printed circuit process that allows easy installation onto structures for in-situ sensing. The SMART Suitcase is an instrument that can interact with the SMART Layer and process the information collected from the structures. Acellent has been providing the system to researchers and companies to try out this new technique. Currently, this system is being evaluated by aircraft manufacturers for monitoring fatigue cracks from rivet holes, by an automotive company for inspecting flaws in composite/foam components, and by aerospace companies for detecting damages in composite/honeycomb sandwich structures. Other recent developments include the addition of fiber-optic sensors onto the SMART Layer and proving the SMART Layer for composite RTM process.

Paper Details

Date Published: 15 July 2002
PDF: 10 pages
Proc. SPIE 4701, Smart Structures and Materials 2002: Smart Structures and Integrated Systems, (15 July 2002); doi: 10.1117/12.474698
Show Author Affiliations
Mark Lin, Acellent Technologies, Inc. (United States)
Amrita Kumar, Acellent Technologies, Inc. (United States)
Xinlin Qing, Acellent Technologies, Inc. (United States)
Shawn J. Beard, Acellent Technologies, Inc. (United States)


Published in SPIE Proceedings Vol. 4701:
Smart Structures and Materials 2002: Smart Structures and Integrated Systems
L. Porter Davis, Editor(s)

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