Share Email Print
cover

Proceedings Paper

High resolution negative i-line resist and process for metal lift-off applications
Author(s): Medhat A. Toukhy; Salem K. Mullen; Ping-Hung Lu; Mark Neisser
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

A newly developed, high resolution negative i-line resist product family, is introduced in this paper. Variation in resist film absorption provides optimum inverted sidewall slopes adequate for most metal lift-off applications. Resist resolution below 0.3micrometers is demonstrated. The capability of further resolution enhancement with the use of a simple shrink process is also demonstrated.

Paper Details

Date Published: 24 July 2002
PDF: 8 pages
Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); doi: 10.1117/12.474287
Show Author Affiliations
Medhat A. Toukhy, Clariant Corp. (United States)
Salem K. Mullen, Clariant Corp. (United States)
Ping-Hung Lu, Clariant Corp. (United States)
Mark Neisser, Clariant Corp. (United States)


Published in SPIE Proceedings Vol. 4690:
Advances in Resist Technology and Processing XIX
Theodore H. Fedynyshyn, Editor(s)

© SPIE. Terms of Use
Back to Top