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Proceedings Paper

Dissolution inhibitors for 157-nm microlithography
Author(s): Will Conley; Daniel A. Miller; Charles R. Chambers; Brian Philip Osborn; Raymond Jui-Pu Hung; Hoang Vi Tran; Brian C. Trinque; Matthew J. Pinnow; Takashi Chiba; Scott McDonald; Paul Zimmerman; Ralph R. Dammel; Andrew R. Romano; C. Grant Willson
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Paper Abstract

Fluorocarbon based polymers have been identified as promising resist candidates for 157nm material design because of their relatively high transparency at this wavelength. This paper reports our recent progress toward developing 157nm resist materials based on transparent dissolution inhibitors. These 2 component resist systems have been prepared and preliminary imaging studies at 157nm are described. Several new approaches to incorporating these transparent monomers into functional polymers have been investigated and are described. The lithographic performance of some of these polymers is discussed.

Paper Details

Date Published: 24 July 2002
PDF: 7 pages
Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); doi: 10.1117/12.474282
Show Author Affiliations
Will Conley, International SEMATECH (United States)
Daniel A. Miller, International SEMATECH (United States)
Charles R. Chambers, Univ. of Texas/Austin (United States)
Brian Philip Osborn, Univ. of Texas/Austin (United States)
Raymond Jui-Pu Hung, Univ. of Texas/Austin (United States)
Hoang Vi Tran, Univ. of Texas/Austin (United States)
Brian C. Trinque, Univ. of Texas/Austin (United States)
Matthew J. Pinnow, Univ. of Texas/Austin (United States)
Takashi Chiba, Univ. of Texas/Austin (United States)
Scott McDonald, Univ. of Texas/Austin (United States)
Paul Zimmerman, International SEMATECH (United States)
Ralph R. Dammel, Clariant Corp. (United States)
Andrew R. Romano, Clariant Corp. (United States)
C. Grant Willson, Univ. of Texas/Austin (United States)


Published in SPIE Proceedings Vol. 4690:
Advances in Resist Technology and Processing XIX
Theodore H. Fedynyshyn, Editor(s)

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