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Proceedings Paper

Factors influencing the properties of fluoropolymer-based resists for 157-nm lithography
Author(s): Gary N. Taylor; Cheng-Bai Xu; Gary Teng; JoAnne Leonard; Charles R. Szmanda; William Lawrence; Sassan Nur; Kirk W. Brown; Al Stephen
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Paper Abstract

This paper describes characterization and lithographic results for one class of low absorbance fluoropolymers that were developed for use in 157 nm lithography. We discuss basic resist properties such as absorbance, hydrophobicity, thickness, resolution and profile for dense 1:1 and semi- dense 1:1.5-10 L/S features, reflection control and plasma etching resistance as a function of composition. Lithographic results were obtained on two types of substrates, silicon and SiON hardmask anti-reflectant. The results on the anti-reflectant were compared to those obtained from simulations using PROLITH. Some of the conclusions of this investigation are: Lower absorbance resists have higher hydrophobicity and better resolution; Resists with high hydrophobicity have very poor adhesion on SiOn, but have very good adhesion on Si and organic anti-reflectants; Only inorganic anti-reflectants have sufficient absorption to provide very low reflectance in <30nm thick films; 100 nm 1:1 L/S resolution is attained in 205 nm thick resist on Si at a resist absorption of 2.2/micrometers . The profile is tapered due to absorption; Adhesion to SiON has been achieved by polymer modification.

Paper Details

Date Published: 24 July 2002
PDF: 7 pages
Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); doi: 10.1117/12.474261
Show Author Affiliations
Gary N. Taylor, Shipley Co. Inc. (United States)
Cheng-Bai Xu, Shipley Co. Inc. (United States)
Gary Teng, Shipley Co. Inc. (United States)
JoAnne Leonard, Shipley Co. Inc. (United States)
Charles R. Szmanda, Shipley Co. Inc. (United States)
William Lawrence, Shipley Co. Inc. (United States)
Sassan Nur, Shipley Co. Inc. (United States)
Kirk W. Brown, Shipley Co. Inc. (United States)
Al Stephen, Shipley Co. Inc. (United States)


Published in SPIE Proceedings Vol. 4690:
Advances in Resist Technology and Processing XIX
Theodore H. Fedynyshyn, Editor(s)

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