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Proceedings Paper

Dissolution rate measurements for resist processing in supercritical carbon dioxide
Author(s): Victor Quan Pham; Gina L. Weibel; Nagesh G. Rao; Christopher Kemper Ober
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Paper Abstract

A dissolution rate monitor (DRM) was successfully constructed to study the behavior of thin photoresist films undergoing the dissolution process in supercritical carbon dioxide (SCCO2). The DRM is based on the principles of interferometry but requires special modifications to the processing vessel to allow for the passage of transmitted and reflected He-Ne laser light. Dissolution rates obtained agree well with independent profilometric measurements of film thickness loss. We found that for block and random copolymers of THPMA-F7MA, dissolution rates vary with film thickness, slowing down considerably towards the silicon surface. This behavior was also observed in TBMA-F7MA random copolymers.

Paper Details

Date Published: 24 July 2002
PDF: 7 pages
Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); doi: 10.1117/12.474241
Show Author Affiliations
Victor Quan Pham, Cornell Univ. (United States)
Gina L. Weibel, Cornell Univ. (United States)
Nagesh G. Rao, Rensselaer Polytechnic Institute (United States)
Christopher Kemper Ober, Cornell Univ. (United States)


Published in SPIE Proceedings Vol. 4690:
Advances in Resist Technology and Processing XIX
Theodore H. Fedynyshyn, Editor(s)

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