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Proceedings Paper

Ultra-thick lithography for advanced packaging and MEMS
Author(s): Chad Brubaker; Rafiqul Islam; Helge Luesebrink
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Paper Abstract

An ever increasing need exists for thick resist layers in the processing of MEMS and for advanced packaging. Applications in the MEMS field include bulk micromachining, surface micromachining, and the actual creating of active device structures. For advanced packaging, the applications are in redistribution and passivation layers, and micromolds for metal bumps. The various applications can require resist layer thicknesses up to and exceeding 1000 micrometers . In order to properly achieve these thicknesses, appropriate coating materials were developed by manufacturers. These materials include AZ P4620, Shipley SPR220, AZ PLP100XT, JSR THB 611P, and SU-8. Finally, equipment was developed to handle these materials, in the form of specialized coating equipment and contact/proximity aligners.

Paper Details

Date Published: 24 July 2002
PDF: 7 pages
Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); doi: 10.1117/12.474225
Show Author Affiliations
Chad Brubaker, EV Group Inc. (United States)
Rafiqul Islam, EV Group Inc. (United States)
Helge Luesebrink, EV Group Inc. (United States)


Published in SPIE Proceedings Vol. 4690:
Advances in Resist Technology and Processing XIX
Theodore H. Fedynyshyn, Editor(s)

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