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Proceedings Paper

Maleimide-based tetrapolymers for use in lift-off resists
Author(s): Cindy X. Chen; Rodney J. Hurditch; Donald W. Johnson; Daniel J. Nawrocki
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Paper Abstract

Alkaline soluble maleimide based tetrapolymers which were prepared by free radical copolymerization are found to be suitable for use as non-imaginable resists in multilevel photolithographic processing. These materials offer widely variable undercut rates because of the ability to vary the composition during free radical polymerization and show little or no scumming when used in lift-off resist. This new polymer system may also be used as the base soluble resin in a photoresist formulation or a base soluble antiflective coating composition as well as used in making lift-off resists.

Paper Details

Date Published: 24 July 2002
PDF: 8 pages
Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); doi: 10.1117/12.474224
Show Author Affiliations
Cindy X. Chen, MicroChem Corp. (United States)
Rodney J. Hurditch, MicroChem Corp. (United States)
Donald W. Johnson, MicroChem Corp. (United States)
Daniel J. Nawrocki, MicroChem Corp. (United States)

Published in SPIE Proceedings Vol. 4690:
Advances in Resist Technology and Processing XIX
Theodore H. Fedynyshyn, Editor(s)

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