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Proceedings Paper

High-performance 193-nm resist composition using hybrid copolymers of cycloolefin/maleic anhydride (COMA)/methacrylate
Author(s): Dalil Rahman; Eric L. Alemy; Will Conley; Daniel Miller; Ralph R. Dammel; Woo-Kyu Kim; Takanori Kudo; Sang-Ho Lee; Seiya Masuda; Douglas S. McKenzie; Munirathna Padmanaban
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Paper Abstract

A high performance 193 nm resist has been developed from a novel hybrid copolymer based on a cycloolefin-maleic anhydride and methacrylate (COMA/Methacrylate) polymer system. A variety of copolymers have been synthesized from t-butyl norbornene carboxylate (BNC), t-butyl tetracyclo [4.4.0.1.2,617,10]dodec-8-ene-3-carboxylate (BTCDC), and 5-[2-trifluoromethyl-2,1,1-trifluoro-2-hydroxypropyl]-2- norbornene (F1) with different types of methacrylate monomers and maleic anhydride (MA). The effect of the monomers and the ratio of monomers in the copolymer on lithographic performance and etch rate has been studied. Lithographic evaluation of some of these polymers has shown resolution down to 80 nm using conventional 193 nm illumination and standard development conditions, particularly for semi and fully isolated lines. This paper will report the chemistry of the polymer platform and relative advantages of having certain monomers in terms of lithographic performance and line edge roughness.

Paper Details

Date Published: 24 July 2002
PDF: 9 pages
Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); doi: 10.1117/12.474210
Show Author Affiliations
Dalil Rahman, Clariant Corp. (United States)
Eric L. Alemy, Clariant Corp. (United States)
Will Conley, International SEMATECH (United States)
Daniel Miller, International SEMATECH (United States)
Ralph R. Dammel, Clariant Corp. (United States)
Woo-Kyu Kim, Clariant Corp. (United States)
Takanori Kudo, Clariant Corp. (United States)
Sang-Ho Lee, Clariant Corp. (United States)
Seiya Masuda, Clariant Corp. (Japan)
Douglas S. McKenzie, Clariant Corp. (United States)
Munirathna Padmanaban, Clariant Corp. (United States)


Published in SPIE Proceedings Vol. 4690:
Advances in Resist Technology and Processing XIX
Theodore H. Fedynyshyn, Editor(s)

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