Share Email Print
cover

Proceedings Paper

Negative photoresist for 157-nm microlithography; a progress report
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The design of 157 nm photoresists is a daunting task since air, water, and most organic compounds are opaque at this wavelength. Spectroscopic studies1 led to the observation that fluorinated hydrocarbons and siloxanes offer the best hope for the transparency that is necessary for the design of an effective 157nm photoresist, and these classes of materials have quickly become the prominent platforms for a variety of research activities in this field. There have been a number of authors that have suggested that negative resists have unique attributes for specific device applications. Numerous authors have discussed negative photoresists over the years. There are many uses for such materials at various levels in a semiconductor device. One such use is with complementary phase shift mask thus eliminating the need for a second exposure step. This paper reports our recent progress toward developing a negative 157nm resist materials based on fluoropolymers with crosslinkers that are transparent at 157nm. The authors will report on the synthesis of the polymers used in this work along with the crosslinkers and other additives used in the formulation of the photoresist. Imaging experiments at practical film thicknesses at 157nm with binary and strong phase shifting masks will be shown demonstrating imaging capabilities. Spectroscopic data demonstrating chemical mechanisms and material absorbance will be shown along with other process related information.

Paper Details

Date Published: 24 July 2002
PDF: 7 pages
Proc. SPIE 4690, Advances in Resist Technology and Processing XIX, (24 July 2002); doi: 10.1117/12.474187
Show Author Affiliations
Will Conley, International SEMATECH (United States)
Brian C. Trinque, Univ. of Texas at Austin (United States)
Daniel A. Miller, International SEMATECH (United States)
Paul Zimmerman, International SEMATECH (United States)
Takanori Kudo, Clariant Corp. (United States)
Ralph R. Dammel, Clariant Corp. (United States)
Andrew R. Romano, Clariant Corp. (United States)
C. Grant Willson, Univ. of Texas at Austin (United States)


Published in SPIE Proceedings Vol. 4690:
Advances in Resist Technology and Processing XIX
Theodore H. Fedynyshyn, Editor(s)

© SPIE. Terms of Use
Back to Top