Proceedings PaperApplication of moire interferometry to thermal strain analysis for electronics packaging
|Format||Member Price||Non-Member Price|
|GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free.||Check Access|
The moire interferometry has been used to investigate the strains induced by thermal loading in various electronics packages. The AFM scanning moire technique has also been utilized to measure the strains of electronics packages with an even better resolution. The advantages and disadvantages of the full field moire, the micro moire, and the AFM scanning moire techniques are compared.