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Proceedings Paper

Application of moire interferometry to thermal strain analysis for electronics packaging
Author(s): Zhaowei Zhong
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Paper Abstract

The moire interferometry has been used to investigate the strains induced by thermal loading in various electronics packages. The AFM scanning moire technique has also been utilized to measure the strains of electronics packages with an even better resolution. The advantages and disadvantages of the full field moire, the micro moire, and the AFM scanning moire techniques are compared.

Paper Details

Date Published: 17 February 2003
PDF: 7 pages
Proc. SPIE 4833, Applications of Photonic Technology 5, (17 February 2003); doi: 10.1117/12.474040
Show Author Affiliations
Zhaowei Zhong, Nanyang Technological Univ. (Singapore)


Published in SPIE Proceedings Vol. 4833:
Applications of Photonic Technology 5

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