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Proceedings Paper

Reduction of stress cracking in micromachining of glass by preheating of samples
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Paper Abstract

Laser micromachining may be used for a variety of applications including drilling holes or creating trenches in dielectric materials. Cracking around the ablated features can be a significant problem for many applications, particularly when micromachining glass. One possible method for crack reduction, investigated here, involves heating of the substrate during ablation. This leads to a more ductile material that is more able to withstand the thermal shock of the ablation process. In order to increase the ductility, the glass targets are heated by physical contact with an electric heating element. The results of micromachining are analyzed using an optical microscope. The amount of cracking is quantified in terms of the number of visible radial cracks. For nanosecond micromachining, a reduction in the number of cracks and an improvement in the quality of the holes are observed as the glass is heated. The relative improvement using heated substrates and nanosecond pulses is also compared to femtosecond ablation of room temperature substrates.

Paper Details

Date Published: 17 February 2003
PDF: 7 pages
Proc. SPIE 4833, Applications of Photonic Technology 5, (17 February 2003); doi: 10.1117/12.473933
Show Author Affiliations
Michael A. Argument, Univ. of Alberta (Canada)
Kenneth Chau, Univ. of Alberta (Canada)
Ying Y. Tsui, Univ. of Alberta (Canada)
Robert Fedosejevs, Univ. of Alberta (Canada)

Published in SPIE Proceedings Vol. 4833:
Applications of Photonic Technology 5
Roger A. Lessard; George A. Lampropoulos; Gregory W. Schinn, Editor(s)

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