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Proceedings Paper

Optoelectronic packaging technologies for chip-level optical interconnections
Author(s): Hideyuki Takahara
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Paper Abstract

Parallel optical interconnection modules has been used for inter- and intra- hardware systems to overcome the bottleneck of electrical interconnection. The next-generation high-throughput telecommunication systems over several tera-bit-per second and high-speed computer systems over several GHz require chip-level optical interconnection as well as MCM-level optical interconnection. This paper describes chip-level optoelectronic packaging technologies to construct future high-performance telecommunication and computer hardware systems. The key technologies include optoelectronic chip on film(OE-COF) packaging technology, and fiber-less optical I/O-BGA packaging technology using microlenses for optical input or output terminals. The OE-COF is composed of flip-chip bonded optical devices and LSIs on the optical waveguide film with impedance-matched electrical lines for flexible OE packaging. The BGA package can allow wide-misalignment of ±50μm, which is compatible with the performance of current electronic assembly machines, and is useful for high-density and low-cost packaging on boards.

Paper Details

Date Published: 25 November 2002
PDF: 9 pages
Proc. SPIE 4805, Design and Fabrication of Planar Optical Waveguide Devices and Materials, (25 November 2002); doi: 10.1117/12.473744
Show Author Affiliations
Hideyuki Takahara, NTT Corp. (Japan)

Published in SPIE Proceedings Vol. 4805:
Design and Fabrication of Planar Optical Waveguide Devices and Materials
Robert A. Norwood, Editor(s)

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