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Proceedings Paper

Process latitudes in projection printing
Author(s): Eytan Barouch; Uwe Hollerbach; Steven A. Orszag; Brian D. Bradie; Martin C. Peckerar
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Paper Abstract

A simulation package has been developed to address a wide variety of process latitude issues. The authors demonstrate its versatility by studying three examples: (i) process latitude degradation due to notching, (ii) line width dependence of a newly developed negative I-line chemically amplified resist on baking time, and (iii) linewidth control of an exposed x-ray 0.5 (mu) line as a function of baking time. A powerful all-purpose 3-D dissolution algorithm has been developed for this purpose. It is the only dissolution algorithm capable of handling changes to topology of the dissolution surface.

Paper Details

Date Published: 1 August 1991
PDF: 9 pages
Proc. SPIE 1465, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing, (1 August 1991); doi: 10.1117/12.47360
Show Author Affiliations
Eytan Barouch, Princeton Univ. (United States)
Uwe Hollerbach, Princeton Univ. (United States)
Steven A. Orszag, Princeton Univ. (United States)
Brian D. Bradie, Naval Research Lab. (United States)
Martin C. Peckerar, Naval Research Lab. (United States)

Published in SPIE Proceedings Vol. 1465:
Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing
Martin C. Peckerar, Editor(s)

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