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Proceedings Paper

TIS-WIS interaction characterization on overlay measurement tool
Author(s): Kenji Hoshi; Eiichi Kawamura; Hiroshi Morohoshi; Hideki Ina; Takanori Fujimura; Hiroyuki Kurita; Joel L. Seligson
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Paper Abstract

Modern overlay metrology tools achieve the required metrology accuracy by controlling critical asymmetries in the imaging optics, and by compensating for the remaining asymmetries through TIS-calibration. We extend our study on the TIS-WIS interaction in stepper alignment optics to the overlay metrology tool, and propose a new method for characterizing residual TIS. This method is based on the examination of the through-focus behavior of the metrology tool on a wafer with a simple, TIS-sensitive structure.

Paper Details

Date Published: 16 July 2002
PDF: 9 pages
Proc. SPIE 4689, Metrology, Inspection, and Process Control for Microlithography XVI, (16 July 2002); doi: 10.1117/12.473514
Show Author Affiliations
Kenji Hoshi, Fujitsu Ltd. (Japan)
Eiichi Kawamura, Fujitsu Ltd. (Japan)
Hiroshi Morohoshi, Canon Inc. (Japan)
Hideki Ina, Canon Inc. (Japan)
Takanori Fujimura, KLA-Tencor Japan Ltd. (Japan)
Hiroyuki Kurita, KLA-Tencor Japan Ltd. (Japan)
Joel L. Seligson, KLA-Tencor Corp. (Israel)


Published in SPIE Proceedings Vol. 4689:
Metrology, Inspection, and Process Control for Microlithography XVI
Daniel J. C. Herr, Editor(s)

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