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Proceedings Paper

Overlay metrology results on leading-edge Cu processes
Author(s): Vincent Vachellerie; Delia Ristoiu; Alain G. Deleporte; Pierre-Olivier Sassoulas; Philippe Spinelli; Marc Poulingue; Pascal Fabre; Rolf Arendt; Ganesh Sundaram; Paul C. Knutrud
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Paper Abstract

As geometrical dimensions of semiconductor devices decrease, the need to introduce Cu processes into the fabrication cycle becomes increasingly important as a means of maintaining line resistances and circuit time constants. However, the success of implementing such as fabrication process is dependent on the ability to characterize it through quantitative means, such as Overlay metrology. In this paper we examine the overlay measurement results which have been obtained on a Cu based CMOS process at the 0.12 (Mu) m technology node. Overlay measurements were taken over a wide range of process conditions, and included wafers exhibiting extreme image contrast reversal, grainy conditions and low contrast. These factors have traditionally led to a decreased ability to make repeatable measurements, if the measurements could be made at all. Our results cover the important metrics of overlay metrology, and include precision, recipe portability, and measurement success rates. The results suggest that the overlay metrology issues encountered with such leading edge processes need not pose intractable barriers to obtaining reliable overlay metrology data.

Paper Details

Date Published: 16 July 2002
PDF: 14 pages
Proc. SPIE 4689, Metrology, Inspection, and Process Control for Microlithography XVI, (16 July 2002); doi: 10.1117/12.473461
Show Author Affiliations
Vincent Vachellerie, STMicroelectronics (France)
Delia Ristoiu, STMicroelectronics (France)
Alain G. Deleporte, STMicroelectronics (France)
Pierre-Olivier Sassoulas, STMicroelectronics (France)
Philippe Spinelli, STMicroelectronics (France)
Marc Poulingue, Schlumberger Semiconductor Solutions (France)
Pascal Fabre, Schlumberger Semiconductor Solutions (France)
Rolf Arendt, Schlumberger Semiconductor Solutions (Germany)
Ganesh Sundaram, Schlumberger Semiconductor Solutions (United States)
Paul C. Knutrud, Schlumberger Semiconductor Solutions (United States)


Published in SPIE Proceedings Vol. 4689:
Metrology, Inspection, and Process Control for Microlithography XVI
Daniel J. C. Herr, Editor(s)

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