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Proceedings Paper

Application and integration of a focused ion beam circuit repair system
Author(s): John A. Lange; Chris Allen
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Paper Abstract

The use of focused ion beam (FIB) circuit repair systems has drastically affected the entire design cycle of modern integrated circuits. Product analysis is changing as well with the ability of a focussed ion beam system to make very accurate cuts on a die and then image the layers using differentiation by the primary ion beam. Transmission electron microscopy is also being positively affected by this new technique due to its ability to produce thinner samples with more positive location than were available by previous techniques. In order to maximize the return, this type of system is best utilized by many operators rather than a select dedicated group. The applications and the organization of use of one such system is described in the deign debug phase of the advanced microprocessor, the Motorola MC68040, along with some suggestions for future directions of focused ion beam machines.

Paper Details

Date Published: 1 August 1991
PDF: 7 pages
Proc. SPIE 1465, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing, (1 August 1991); doi: 10.1117/12.47342
Show Author Affiliations
John A. Lange, Motorola, Inc. (United States)
Chris Allen, Motorola, Inc. (United States)

Published in SPIE Proceedings Vol. 1465:
Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing
Martin C. Peckerar, Editor(s)

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