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Proceedings Paper

X-ray lithography system development at IBM: overview and status
Author(s): Juan R. Maldonado
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Paper Abstract

This paper describes the work conducted at IBM to study the feasibility of x-ray lithography for production of high-density silicon chips. The system approach to x-ray lighography adopted at IBM which considers the interaction of all the components is presented. In particular, the following areas are described in some detail: x-ray sources, masks, resists, exposure tools, prototype devices fabricated with x-ray lighography, and the resolution of x- ray lighography. In addition, the status of the Advanced Lithography Facility which house the compact electron storage ring x-ray source, procured by IBM from Oxford Instruments, is presented.

Paper Details

Date Published: 1 August 1991
PDF: 14 pages
Proc. SPIE 1465, Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing, (1 August 1991); doi: 10.1117/12.47339
Show Author Affiliations
Juan R. Maldonado, IBM Corp. (United States)

Published in SPIE Proceedings Vol. 1465:
Electron-Beam, X-Ray, and Ion-Beam Submicrometer Lithographies for Manufacturing
Martin C. Peckerar, Editor(s)

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