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Improved resolution of thick film resist (effect of pre-bake condition)
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Paper Abstract

The effect of pre-baking conditions on the resolution and aspect ratio of thick-film resists is examined in order to improve resist processing performance. Resist samples are pre-baked at various temperatures and for various baking times, and a range of resist properties are examined. It is found that the pre-baking conditions affording the best resist pattern profile and development contrast are 125 °C for 7 min. The mechanisms responsible for the observed variations in pattern profile are studied by comparing and simulating the development activation energy, the change in the amount of solvent and photo active compound (PAC) during pre-baking, the residual solvent amount in the resist, and the transmission after pre-baking. The results indicate that there are two factors responsible for retarding the pattern formation process and causing degradation of pattern profile and resolution. One mechanism is N2 bubbling during development, which is caused by N2 trapped in residual solvent during exposure. The other mechanism is thermal decomposition of the PAC during baking, which weakens the retardation of development unexposed resist.

Paper Details

Date Published: 15 January 2003
PDF: 21 pages
Proc. SPIE 4979, Micromachining and Microfabrication Process Technology VIII, (15 January 2003); doi: 10.1117/12.472761
Show Author Affiliations
Yoshihisa Sensu, Litho Tech Japan Corp. (Japan)
Atsushi Sekiguchi, Litho Tech Japan Corp. (Japan)

Published in SPIE Proceedings Vol. 4979:
Micromachining and Microfabrication Process Technology VIII
John A. Yasaitis; Mary Ann Perez-Maher; Jean Michel Karam, Editor(s)

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