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Proceedings Paper

Measurement of thermal-mechanical noise in MEMS microstructures
Author(s): Todd H. Stievater; William S. Rabinovich; Harvey S. Newman; Rita Mahon; Peter G. Goetz; Jack L. Ebel; David J. McGee
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Paper Abstract

We report absolute measurements of thermal-mechanical noise in microelectromechanical systems. The measurements are made possible with a simple, high resolution optical technique that has a displacement resolution on the order of hundreds of femtometers per root Hz at frequencies of tens of kHz. The measured noise spectrum agrees with the calculated noise level to within 25%, a discrepancy most likely due to uncertainty in the effective dynamic mass of the vibrating bridge. These measurements demonstrate that thermal-mechanical noise can be the dominant noise source in actuated microelectromechanical devices. This noise will become even more pronounced as the size of mechanical devices continues to shrink.

Paper Details

Date Published: 21 January 2003
PDF: 8 pages
Proc. SPIE 4983, MOEMS and Miniaturized Systems III, (21 January 2003); doi: 10.1117/12.472753
Show Author Affiliations
Todd H. Stievater, Naval Research Lab. (United States)
William S. Rabinovich, Naval Research Lab. (United States)
Harvey S. Newman, Naval Research Lab. (United States)
Rita Mahon, Naval Research Lab. (United States)
Peter G. Goetz, Naval Research Lab. (United States)
Jack L. Ebel, Air Force Research Lab. (United States)
David J. McGee, Drew Univ. (United States)

Published in SPIE Proceedings Vol. 4983:
MOEMS and Miniaturized Systems III
James H. Smith, Editor(s)

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