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Proceedings Paper

Sacrificial layer for the fabrication of electroformed cantilevered LIGA microparts
Author(s): Alfredo M. Morales; Georg Aigeldinger; Michelle A. Bankert; Linda A. Domeier; John T. Hachman; Cheryl Hauck; Patrick N. Keifer; Karen L. Krafcik; Dorrance E. McLean; Peter C. Yang
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Paper Abstract

The use of silver filled PMMA as a sacrificial layer for the fabrication of multilevel LIGA microparts is presented. In this technique, a bottom level of standard electroformed LIGA parts is first produced on a metallized substrate such as a silicon wafer. A methyl methacrylate formulation mixed with silver particles is then cast and polymerized around the bottom level of metal parts to produce a conducting sacrificial layer. A second level of PMMA x-ray resist is adhered to the bottom level of metal parts and conducting PMMA and patterned to form another level of electroformed features. This presentation will discuss some the requirements for the successful fabrication of multilevel, cantilevered LIGA microparts. It will be shown that by using a silver filled PMMA, a sacrificial layer can be quickly applied around LIGA components; cantilevered microparts can be electroformed; and the final parts can be quickly released by dissolving the sacrificial layer in acetone.

Paper Details

Date Published: 15 January 2003
PDF: 8 pages
Proc. SPIE 4979, Micromachining and Microfabrication Process Technology VIII, (15 January 2003); doi: 10.1117/12.472751
Show Author Affiliations
Alfredo M. Morales, Sandia National Labs. (United States)
Georg Aigeldinger, Sandia National Labs. (United States)
Michelle A. Bankert, Sandia National Labs. (United States)
Linda A. Domeier, Sandia National Labs. (United States)
John T. Hachman, Sandia National Labs. (United States)
Cheryl Hauck, Lawrence Berkeley National Lab. (United States)
Patrick N. Keifer, Sandia National Labs. (United States)
Karen L. Krafcik, Sandia National Labs. (United States)
Dorrance E. McLean, Sandia National Labs. (United States)
Peter C. Yang, Sandia National Labs. (United States)

Published in SPIE Proceedings Vol. 4979:
Micromachining and Microfabrication Process Technology VIII
John A. Yasaitis; Mary Ann Perez-Maher; Jean Michel Karam, Editor(s)

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