Share Email Print
cover

Proceedings Paper

Microstructure and mechanical properties of nickel microparts electroformed in replicated LIGA molds
Author(s): Alfredo M. Morales; Linda A. Domeier; Marcela G. Gonzales; John T. Hachman; Jill M. Hruby; Steven H. Goods; Dorrance E. McLean; Nancy Yang; Andrew D Gardea
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

A novel process for the rapid replication of electroforming plastic micromolds has been developed and is now being used to produce plated nickel test specimens. The process combines hot embossing or injection molding with metallic microscreens to produce sacrificial electroforming molds with conducting bases and insulating sidewalls. The replicated micromolds differ from standard LIGA molds in that the holes in the microscreen act as insulating defects in the electroforming base. The effects of such defects on the materials properties of electroformed microparts will be discussed and it will be shown that when the surface irregularities corresponding to the microscreen holes are removed, mechanical properties are experimentally indistinguishable from those found in conventionally processed LIGA specimens.

Paper Details

Date Published: 15 January 2003
PDF: 8 pages
Proc. SPIE 4979, Micromachining and Microfabrication Process Technology VIII, (15 January 2003); doi: 10.1117/12.472748
Show Author Affiliations
Alfredo M. Morales, Sandia National Labs. (United States)
Linda A. Domeier, Sandia National Labs. (United States)
Marcela G. Gonzales, Sandia National Labs. (United States)
John T. Hachman, Sandia National Labs. (United States)
Jill M. Hruby, Sandia National Labs. (United States)
Steven H. Goods, Sandia National Labs. (United States)
Dorrance E. McLean, Sandia National Labs. (United States)
Nancy Yang, Sandia National Labs. (United States)
Andrew D Gardea, Sandia National Labs. (United States)


Published in SPIE Proceedings Vol. 4979:
Micromachining and Microfabrication Process Technology VIII
John A. Yasaitis; Mary Ann Perez-Maher; Jean Michel Karam, Editor(s)

© SPIE. Terms of Use
Back to Top