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Proceedings Paper

Reliability evaluation of thermally actuated micromachined relays for space applications
Author(s): Alexander Teverovsky; A. K. Sharma
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Paper Abstract

This paper reports results on electrical characteristics, evaluation of design, and reliability of the first commercially available micromachined relays. The parts have been characterized in a wide range of temperatures (from 100 degrees C to +180 degrees C) and load conditions (voltages from 10 V to 70 V and currents from 5 mA to 200 mA). Mechanical integrity of the parts has been evaluated by subjecting them to multiple mechanical shocks in the range from 100 G to 1000 G up to 10,000 shocks. Life testing was performed at different contact voltages and current loads during 108 switching cycles. To simulate space operation conditions, characteristics of the parts were monitored during vacuum testing. Typical failure modes associated with different test conditions are discussed.

Paper Details

Date Published: 16 January 2003
PDF: 10 pages
Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, (16 January 2003); doi: 10.1117/12.472726
Show Author Affiliations
Alexander Teverovsky, QSS Group, Inc. and NASA Goddard Space Flight Ctr (United States)
NASA Goddard Space Flight Ctr. (United States)
A. K. Sharma, NASA Goddard Space Flight Ctr. (United States)

Published in SPIE Proceedings Vol. 4980:
Reliability, Testing, and Characterization of MEMS/MOEMS II
Rajeshuni Ramesham; Danelle M. Tanner, Editor(s)

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