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Proceedings Paper

Mechanical reliabilty of MEMS fabricated by a special technology using standard silicon wafers
Author(s): Christian Lohmann; Andreas Bertz; Matthias Kuechler; Danny Reuter; Thomas Gessner
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Paper Abstract

This paper presents a new process flow for the fabrication of Air gap Insulated Microstructures (AIM) with strengthened interconnection beams based on standard single crystal silicon wafers. The main focus on the new development was set on the attributes of reliability and fatigue. As a result of our investigations, the interconnection beams were identified as weakest point in the system. To improve the quality of the beams, several material stacks with well defined properties were tested in order to find a suitable material stack for the interconnection beams instead of pure aluminum. The new process flow enables the use of layered structured beams without loosing any of the advantages of the AIM technology and also without increasing the number of masks.

Paper Details

Date Published: 16 January 2003
PDF: 8 pages
Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, (16 January 2003); doi: 10.1117/12.472725
Show Author Affiliations
Christian Lohmann, Technische Univ. Chemnitz (Germany)
Andreas Bertz, Technische Univ. Chemnitz (Germany)
Matthias Kuechler, Fraunhofer-Institut fuer Zuverlaessigkeit und Mikrointegration (Germany)
Danny Reuter, Technische Univ. Chemnitz (Germany)
Thomas Gessner, Technische Univ. Chemnitz (Germany)
Fraunhofer-Institut fuer Zuverlaessigkeit und Mikrointegration (Germany)


Published in SPIE Proceedings Vol. 4980:
Reliability, Testing, and Characterization of MEMS/MOEMS II
Rajeshuni Ramesham; Danelle M. Tanner, Editor(s)

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