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Proceedings Paper

Polymer protective coating for wet deep silicon etching processes
Author(s): Mary Spencer; Kim Ruben; Chenghong Li; Paul Williams; Tony D. Flaim
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Paper Abstract

A need exists for spin-applied polymeric coatings to protect electronic circuitry and other sensitive structures on MEMS devices during deep silicon wet etching processes involving corrosive mixtures of aqueous acids and bases. The challenge exists in developing protective coatings that do not decompose or dissolve in the harsh etchants and, more importantly, that maintain good adhesion to the substrate during the sometimes long etching processes. We have developed a multilayer coating system that is stable and adheres well to silicon nitride and other semiconductor materials and affords chemical protection for at least eight hours in hot potassium hydroxide etchant. The same coating system is also compatible with concentrated hydrofluoric acid etchants, which can diffuse rapidly through many polymeric materials to attack the device substrate.

Paper Details

Date Published: 15 January 2003
PDF: 8 pages
Proc. SPIE 4979, Micromachining and Microfabrication Process Technology VIII, (15 January 2003); doi: 10.1117/12.472717
Show Author Affiliations
Mary Spencer, Brewer Science, Inc. (United States)
Kim Ruben, Brewer Science, Inc. (United States)
Chenghong Li, Brewer Science, Inc. (United States)
Paul Williams, Brewer Science, Inc. (United States)
Tony D. Flaim, Brewer Science, Inc. (United States)

Published in SPIE Proceedings Vol. 4979:
Micromachining and Microfabrication Process Technology VIII
John A. Yasaitis; Mary Ann Perez-Maher; Jean Michel Karam, Editor(s)

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