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Proceedings Paper

Investigation of NEG thick film for vacuum packaging of MEMS
Author(s): Yufeng Jin; Zhi Ping Wang; L. Zhao; P. C. Lim; J. Wei
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Paper Abstract

An approach to maintain vacuum in MEMS devices, by integrating MEMS fabrication process with getter material preparation, is presented in this paper. A coating process for thick film of getter material on silicon and glass wafers, which are common materials in fabrication of MEMS devices and package, has been investigated in detail. The getter material consists of a powder mixture of zirconium, vanadium and iron, which features high sorption capability to active gas such as H2, O2, N2, CO and H2O vapor. Several patterned NEG thick films to simulate different needs in MEMS application have been made. The sorption capacity of the coated getter material was examined. The coating of NEG thick film onto the inner surface of a MEMS pressure sensor and the activation of NEG during anodic bonding process were carried out.

Paper Details

Date Published: 16 January 2003
PDF: 6 pages
Proc. SPIE 4980, Reliability, Testing, and Characterization of MEMS/MOEMS II, (16 January 2003); doi: 10.1117/12.472716
Show Author Affiliations
Yufeng Jin, Singapore Institute of Manufacturing Technology (Singapore)
Peking Univ. (China)
Zhi Ping Wang, Singapore Institute of Manufacturing Technology (Singapore)
L. Zhao, Nanjing Delta King Hi-tech Co. Ltd. (China)
P. C. Lim, Singapore Institute of Manufacturing Technology (Singapore)
J. Wei, Singapore Institute of Manufacturing Technology (Singapore)


Published in SPIE Proceedings Vol. 4980:
Reliability, Testing, and Characterization of MEMS/MOEMS II
Rajeshuni Ramesham; Danelle M. Tanner, Editor(s)

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