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Proceedings Paper

Novel cathodic arc plasma PVD system with column target for the deposition of TiN film and other metallic films
Author(s): Weiyi Liu; Yu Min Li; Zhan Jun Cui; Tian Xi He
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Paper Abstract

A novel cathodic arc plasma physical vapor deposition (PVD) process with column target for the deposition of metals and alloys has been developed. Low voltage and high current power is applied between the column target and anode. With the special designed magnetic field, the arc spots run circularly on the surface on the column target and move up and down with the movement of the magnetic field. The erosion on the target is well distributed. The discharge process is very stable and the working conditions are very wide. The working gas can be argon, nitrogen, oxygen, or any other gases according to the need of the chemical reactive deposition.

Paper Details

Date Published: 1 November 1991
PDF: 3 pages
Proc. SPIE 1519, International Conference on Thin Film Physics and Applications, (1 November 1991); doi: 10.1117/12.47244
Show Author Affiliations
Weiyi Liu, Nankai Univ. (China)
Yu Min Li, Nankai Univ. (China)
Zhan Jun Cui, Nankai Univ. (China)
Tian Xi He, Nankai Univ. (China)


Published in SPIE Proceedings Vol. 1519:
International Conference on Thin Film Physics and Applications

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