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Proceedings Paper

Numerical investigation of EUV mask contact layer defect printability at the 30-nm technology node
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Paper Abstract

The printability of an extreme ultraviolet lithography (EUVL) contact layer defect mask was studied using numerical analyses. Three-dimensional models using rigorous electromagnetic simulations were used to predict the mask printing process at the 30 nm technology node. Two types of EUVL mask contact layer defects were studied, i.e., absorber and buffer layer defects. For the absorber, corner and center defects were evaluated and compared for different contact sizes. For the buffer layer, corner defects were investigated for three different materials: ruthenium, carbon, and silicon oxide. It was found that center contact defects were worse than corner defects. For buffer layer defects, the study showed that for a given size, ruthenium defects have the worst effect, followed by carbon and silicon oxide.

Paper Details

Date Published: 1 July 2002
PDF: 8 pages
Proc. SPIE 4688, Emerging Lithographic Technologies VI, (1 July 2002); doi: 10.1117/12.472347
Show Author Affiliations
Amr Y. Abdo, Univ. of Wisconsin/Madison (United States)
Pei-yang Yan, Intel Corp. (United States)


Published in SPIE Proceedings Vol. 4688:
Emerging Lithographic Technologies VI
Roxann L. Engelstad, Editor(s)

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