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Proceedings Paper

EXTATIC: ASML's alpha-tool development for EUVL
Author(s): Hans Meiling; Jos P.H. Benschop; Robert A. Hartman; Peter Kuerz; Peter Hoghoj; Roland Geyl; Noreen Harned
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Paper Abstract

Within the recently initiated EXTATIC project a complete full-field lithography exposure tool for he 50-nm technology node is being developed. The goal is to demonstrate the feasibility of extreme UV lithography (EUVL) for 50-nm imaging and to reduce technological risks in the development of EUVL production tools. We describe the EUV MEDEA+) framework in which EXTATIC is executed, and give an update on the status of the (alpha) -tool development. A brief summary of our in-house source-collector module development is given, as well as the general vacuum architecture of the (alpha) -tool is discussed. We discuss defect-free reticle handling, and investigated the uses of V-grooved brackets glued to the side of the reticle to reduce particle generation during takeovers. These takeovers do not only occur in the exposure tool, but also in multilayer deposition equipment, e-beam pattern writers, inspection tools, etc., where similar requirements on particle contamination are present. Finally, we present an update of mirror fabrication technology and show improved mirror figuring and finishing results.

Paper Details

Date Published: 1 July 2002
PDF: 12 pages
Proc. SPIE 4688, Emerging Lithographic Technologies VI, (1 July 2002); doi: 10.1117/12.472308
Show Author Affiliations
Hans Meiling, ASML (Netherlands)
Jos P.H. Benschop, ASML (Netherlands)
Robert A. Hartman, ASML (Netherlands)
Peter Kuerz, Carl Zeiss (Germany)
Peter Hoghoj, XENOCS, Inc. (France)
Roland Geyl, SAGEM (France)
Noreen Harned, ASML (United States)


Published in SPIE Proceedings Vol. 4688:
Emerging Lithographic Technologies VI
Roxann L. Engelstad, Editor(s)

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