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Proceedings Paper

Fabrication challenges for next-generation devices: MEMS for rf wireless communications
Author(s): David E. Seeger; Jennifer Lund; Christopher Jahnes; Lili Deligianni; Paivikki Buchwalter; Panayotis C. Andricacos; Raul E. Acosta; Inna V. Babich; Arpan P. Mahorowala; Joanna Rosner; John Cotte
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Paper Abstract

With wireless communications becoming an important technology and growth engine for the semiconductor industry, many semiconductor companies are developing technologies that differentiate themselves in this space. One means of accomplishing this goal is to find a way to integrate passive components, which currently make up over 70 percent of the discrete components in a wireless handset today, directly on-chip thereby greatly simplifying handsets. While a number of technologies are being investigated to allow on- chip integration, MEMS technologies are an important part of this development effort. They have been used to create switches, filters, local oscillators, variable capacitors and high quality factor inductors to name a few examples. The lithography requirements for these devices are very different than those found in standard semiconductor fabrication with the most importatnt involving pattern over extreme topography. In this paper, we discuss some of the fabrication challenges for these devices as well as some approaches that have been demonstrated to satisfy them.

Paper Details

Date Published: 1 July 2002
PDF: 16 pages
Proc. SPIE 4688, Emerging Lithographic Technologies VI, (1 July 2002); doi: 10.1117/12.472298
Show Author Affiliations
David E. Seeger, IBM Thomas J. Watson Research Ctr. (United States)
Jennifer Lund, IBM Thomas J. Watson Research Ctr. (United States)
Christopher Jahnes, IBM Thomas J. Watson Research Ctr. (United States)
Lili Deligianni, IBM Thomas J. Watson Research Ctr. (United States)
Paivikki Buchwalter, IBM Thomas J. Watson Research Ctr. (United States)
Panayotis C. Andricacos, IBM Thomas J. Watson Research Ctr. (United States)
Raul E. Acosta, IBM Thomas J. Watson Research Ctr. (United States)
Inna V. Babich, IBM Thomas J. Watson Research Ctr. (United States)
Arpan P. Mahorowala, IBM Thomas J. Watson Research Ctr. (United States)
Joanna Rosner, IBM Thomas J. Watson Research Ctr. (United States)
John Cotte, IBM Thomas J. Watson Research Ctr. (United States)


Published in SPIE Proceedings Vol. 4688:
Emerging Lithographic Technologies VI
Roxann L. Engelstad, Editor(s)

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