Share Email Print
cover

Proceedings Paper

Glass ion-exchange technology for wavelength management applications
Author(s): Shlomo Ruschin; G. Hurwitz; T. Hurwitz; Avishai Kepten; E. Arad; Y. Soreq; Shimon Eckhouse
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

We report the achievement of buried single-mode waveguides in special Boro-Aluminum-Silicate glass. The waveguides are characterized by very low propogation loss (<.01dB/cm) and negligible birefringence. The optical mode at the input and output ports is essentially identical to the mode of a standard single-mode optical fiber. We fabricated and tested several devices and report here 1×8 and 1×16 powers spitters and an interleaver defined for a 100GHz DWDM network. Due to the low birefringence of the waveguides, the TE and TM responses of the device are undistinguishable by customary characterization equipment. In addition we report a technique for permanent trimming of the otpical circuit by localized heating. This unique advantage of ion-exchange technology, allowed us the adjustment of devices' parameters at post-fabrication stage. As an example, the trimming of a 2×2 directional coupler manifested here in the control of coupling coefficient value over a wide range (0.04-1.5). The process control was such that a target value of 0.5 for the coefficient was accurately attained. The same process enabled us the tuning of the interleaver to the ITU grid within 10pm accuracy.

Paper Details

Date Published: 3 April 2003
PDF: 9 pages
Proc. SPIE 4944, Integrated Optical Devices: Fabrication and Testing, (3 April 2003); doi: 10.1117/12.472034
Show Author Affiliations
Shlomo Ruschin, ColorChip Inc. (Israel)
G. Hurwitz, ColorChip Inc. (Israel)
T. Hurwitz, ColorChip Inc. (Israel)
Avishai Kepten, ColorChip Inc. (Israel)
E. Arad, ColorChip Inc. (Israel)
Y. Soreq, ColorChip Inc. (Israel)
Shimon Eckhouse, ColorChip Inc. (Israel)


Published in SPIE Proceedings Vol. 4944:
Integrated Optical Devices: Fabrication and Testing

© SPIE. Terms of Use
Back to Top