Share Email Print
cover

Proceedings Paper

Research and fabrication of integrated optical chip of hybrid-integrated optical acceleration seismic geophone
Author(s): Caihe Chen; Bo Wu; Guilan Ding; Yuming Cui
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

The hybrid-integrated optical acceleration seismic geophone is present for the first time in this paper. Double-Y branching guide, phase modulator and polarizers, which are integrated on the LiNbO3 substrate to constitute the Michelson interference chip, hardcore of the accelerometer, are analyzed and designed respectively. The chip is fabricated successfully and the lighting test is proceeding to check the quality of the chip. The waveguides' images of chip fabricated is presented. The results of and lighting test are given too.

Paper Details

Date Published: 20 September 2002
PDF: 7 pages
Proc. SPIE 4919, Advanced Materials and Devices for Sensing and Imaging, (20 September 2002); doi: 10.1117/12.470943
Show Author Affiliations
Caihe Chen, Tianjin Univ. (China)
Bo Wu, Tianjin Univ. (China)
Guilan Ding, Tianjin Univ. (China)
Yuming Cui, Tianjin Univ. (China)


Published in SPIE Proceedings Vol. 4919:
Advanced Materials and Devices for Sensing and Imaging
Jianquan Yao; Yukihiro Ishii, Editor(s)

© SPIE. Terms of Use
Back to Top