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Proceedings Paper

Determination of the adhesive load by holographic interferometry using the results of FEM calculations
Author(s): Thomas Bischof; Werner P. O. Jueptner
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Paper Abstract

The adhesive bonding, especially the overlap adhesive bonded joint, is used in many sectors, such as aircraft construction. For the development of new kinds of adhesives, there must be a testing technique which allows a fast and reliable detection of the stress distribution in the adhesive layer. In BIAS, a method was developed which allows the entire specimen deformation to be measured. This deformation can be split into two parts: the adhesive layer, and the two plate-deformation. It has been shown by FEM calculation that in regions where the adhesive layer strain has its maximum, the entire specimen deformation is almost exclusively composed of the adhesive layer deformation. With this knowledge, it is possible to determine the adhesive layer stress distribution by measuring the total deformation of the specimen.

Paper Details

Date Published: 1 October 1991
PDF: 6 pages
Proc. SPIE 1508, Industrial Applications of Holographic and Speckle Measuring Techniques, (1 October 1991); doi: 10.1117/12.47093
Show Author Affiliations
Thomas Bischof, BIAS (Germany)
Werner P. O. Jueptner, BIAS (Germany)


Published in SPIE Proceedings Vol. 1508:
Industrial Applications of Holographic and Speckle Measuring Techniques
Werner P. O. Jueptner, Editor(s)

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