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Proceedings Paper

Laser applications in integrated circuit packaging
Author(s): Yongfeng Lu; Wen Dong Song; ZhongMin Ren; Chengwu An; Kaidong D. Ye; DaMing Liu; Weijie Wang; Ming Hui Hong; Tow Chong Chong
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Paper Abstract

Laser processing has large potential in the packaging of integrated circuits (IC). It can be used in many applications such as laser cleaning of IC mold tools, laser deflash to remove mold flash form heat sinks and lead wires of IC packages, laser singulation of BGA and CSP, laser reflow of solder ball on GBA, laser marking on packages and on SI wafers. During the implementation of all these applications, laser parameters, material issues, throughput, yield, reliability and monitoring techniques have to b taken into account. Monitoring of laser-induced plasma and laser induced acoustic wave has been used to understand and to control the processes involved in these applications.

Paper Details

Date Published: 18 June 2002
PDF: 11 pages
Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); doi: 10.1117/12.470667
Show Author Affiliations
Yongfeng Lu, Data Storage Institute/National Univ. of Singapore (United States)
Wen Dong Song, Data Storage Institute/National Univ. of Singapore (Singapore)
ZhongMin Ren, Data Storage Institute/National Univ. of Singapore (Singapore)
Chengwu An, Data Storage Institute/National Univ. of Singapore (Singapore)
Kaidong D. Ye, Data Storage Institute/National Univ. of Singapore (Singapore)
DaMing Liu, Data Storage Institute/National Univ. of Singapore (Singapore)
Weijie Wang, Data Storage Institute/National Univ. of Singapore (Singapore)
Ming Hui Hong, Data Storage Institute/National Univ. of Singapore (Singapore)
Tow Chong Chong, Data Storage Institute/National Univ. of Singapore (Singapore)


Published in SPIE Proceedings Vol. 4637:
Photon Processing in Microelectronics and Photonics
Jan J. Dubowski; Willem Hoving; Koji Sugioka; Malcolm C. Gower; Richard F. Haglund; Alberto Pique; Frank Traeger; Jan J. Dubowski; Willem Hoving, Editor(s)

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