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Proceedings Paper

Laser microwelding of electronic components
Author(s): Hans Kurt Toenshoff; Klaus Koerber; Christian Kulik; K. Schafer
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Paper Abstract

This paper presents results on machine and process development for laser welding of surface mounted devices on thermal resistant polymer based molded interconnect devices with copper layers of 35 micrometers and 70 micrometers thickness. Characteristics, advantages and problems of this technology are shown and possibilities to achieve reproducible results are discussed. The investigations are carried out with pulsed Nd:YAG-lasers wit a maximum average power of 300 W. Additionally, a process control concept evaluating the reflected process radiation is discussed.

Paper Details

Date Published: 18 June 2002
PDF: 9 pages
Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); doi: 10.1117/12.470661
Show Author Affiliations
Hans Kurt Toenshoff, Laser Zentrum Hannover e.V. (Germany)
Klaus Koerber, Laser Zentrum Hannover e.V. (Germany)
Christian Kulik, Laser Zentrum Hannover e.V. (Germany)
K. Schafer, Laser Zentrum Hannover e.V. (Germany)


Published in SPIE Proceedings Vol. 4637:
Photon Processing in Microelectronics and Photonics
Jan J. Dubowski; Willem Hoving; Koji Sugioka; Malcolm C. Gower; Richard F. Haglund; Alberto Pique; Frank Traeger; Jan J. Dubowski; Willem Hoving, Editor(s)

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