Share Email Print

Proceedings Paper

Laser welding of polymers using high-power diode lasers
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

Laser welding of polymers using high power diode lasers offers specific process advantages over conventional technologies, such as short process times while providing optically and qualitatively valuable weld seams, contactless yielding of the joining energy, absence of process induced vibrations, imposing minimal thermal stress and avoiding particle generation. Furthermore, this method exhibits high integration capabilities and automatization potential. Moreover, because of the current favorable cost development within the high power diode laser market laser welding of polymers has become more and more an industrially accepted joining method. This novel technology permits both, reliable high quality joining of mechanically and electronically highly sensitive micro components and hermetic sealing of macro components. There are different welding strategies available, which are adaptable to the current application. Within the frame of this discourse scientific and also application oriented result concerning laser transmission welding of polymers using preferably diode lasers are presented. Besides the sue laser system the fundamental process strategies as well as decisive process parameters are illustrated. The importance of optical, thermal and mechanical properties is discussed. Applications at real technical components will be presented, demonstrating the industrial implementation capability and the advantages of a novel technology.

Paper Details

Date Published: 18 June 2002
PDF: 14 pages
Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); doi: 10.1117/12.470660
Show Author Affiliations
Friedrich G. Bachmann, ROFIN-SINAR Laser GmbH (Germany)
Ulrich A. Russek, Fraunhofer-Institute for Laser Technology (Germany)

Published in SPIE Proceedings Vol. 4637:
Photon Processing in Microelectronics and Photonics
Jan J. Dubowski; Koji Sugioka; Malcolm C. Gower; Willem Hoving; Richard F. Haglund; Alberto Pique; Frank Traeger; Jan J. Dubowski; Willem Hoving, Editor(s)

© SPIE. Terms of Use
Back to Top