Share Email Print
cover

Proceedings Paper

Laser joining of glass with silicon
Format Member Price Non-Member Price
PDF $14.40 $18.00

Paper Abstract

New joining techniques are required for the variety of materials used in the manufacture of microsystems. Lasers are emerging as a useful tool for joining miniaturized devices. The beam can be focused to less than .001 inch allowing localized joining of very small geometries. There is minimal heat input into the part so distortion and change in material properties is minimal. The high quality of the laser welds and the precise process control enable hermetic sealing.

Paper Details

Date Published: 18 June 2002
PDF: 9 pages
Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); doi: 10.1117/12.470657
Show Author Affiliations
Reiner Witte, Fraunhofer USA (United States)
Hans-Joachim Herfurth, Fraunhofer USA (United States)
Stefan Heinemann, Fraunhofer USA (United States)


Published in SPIE Proceedings Vol. 4637:
Photon Processing in Microelectronics and Photonics
Jan J. Dubowski; Willem Hoving; Koji Sugioka; Malcolm C. Gower; Richard F. Haglund; Alberto Pique; Frank Traeger; Jan J. Dubowski; Willem Hoving, Editor(s)

© SPIE. Terms of Use
Back to Top