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Proceedings Paper

Integrated tool for fabrication of electronic components by laser direct write
Author(s): Scott A. Mathews; Chengping Zhang; Todd Kegresse; David Liu
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Paper Abstract

A prototype workstation has been developed that allows the fabrication of passive electronic components at low temperatures using a laser direct-write process. The work station combines a variety of laser processing techniques onto a single, integrated platform. These techniques include material deposition, laser micromachining, laser sintering, and laser trimming. One particular process, referred to as 'mill and fill', combines the laser micromachining ability of the tool with 'off-the-shelf' conductor pastes to allow the fabrication of high density metalization at very low temperatures. The present work describes the details of the 'mill and fill' process and shows examples of prototype devices fabricated using this technique.

Paper Details

Date Published: 18 June 2002
PDF: 5 pages
Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); doi: 10.1117/12.470644
Show Author Affiliations
Scott A. Mathews, Potomac Photonics, Inc. (United States)
Chengping Zhang, Potomac Photonics, Inc. (United States)
Todd Kegresse, Potomac Photonics, Inc. (United States)
David Liu, Potomac Photonics, Inc. (United States)

Published in SPIE Proceedings Vol. 4637:
Photon Processing in Microelectronics and Photonics
Jan J. Dubowski; Koji Sugioka; Malcolm C. Gower; Willem Hoving; Richard F. Haglund Jr.; Alberto Pique; Frank Traeger; Jan J. Dubowski; Willem Hoving, Editor(s)

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