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Proceedings Paper

Microscale bending of brittle materials using pulsed and CW lasers
Author(s): X. Richard Zhang; Xianfan Xu
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Paper Abstract

This work demonstrated using pulsed and CW lasers for microscale bending of brittle materials, including glass, ceramic, and silicon. Based on the absorption characteristics of these materials, different types of laser were used for achieving bending. Experimental studies were conducted to find out relations between bending angles and laser operation parameters.

Paper Details

Date Published: 18 June 2002
PDF: 6 pages
Proc. SPIE 4637, Photon Processing in Microelectronics and Photonics, (18 June 2002); doi: 10.1117/12.470635
Show Author Affiliations
X. Richard Zhang, Purdue Univ. (United States)
Xianfan Xu, Purdue Univ. (United States)


Published in SPIE Proceedings Vol. 4637:
Photon Processing in Microelectronics and Photonics
Jan J. Dubowski; Willem Hoving; Koji Sugioka; Malcolm C. Gower; Richard F. Haglund; Alberto Pique; Frank Traeger; Jan J. Dubowski; Willem Hoving, Editor(s)

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