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Proceedings Paper

Shaped-field eddy-current sensors and arrays
Author(s): Andrew P. Washabaugh; Vladimir A. Zilberstein; Darrell E. Schlicker; Ian Shay; David Grundy; Neil J. Goldfine
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Paper Abstract

Shaped-field eddy current Meandering Winding Magnetometer (MWM) sensors and MWM-Arrays, designed to fit physical models provide new inspection capabilities for materials characterization, quality control, and damage detection in aerospace structures. Accurate modeling is enabled by designing primary winding distributions that create either a spatially periodic magnetic field or a single period shaped- field. Accurate modeling of the sensor response permits absolute property measurements with minimal calibration, e.g., calibration in air without a reference standard. This paper will provide an overview of shaped-field eddy- current sensors and their use in several aerospace applications. In one group of applications, the sensors are permanently mounted on test components and can be mounted on actual structures for on-line fatigue damage monitoring. This supports the damage tolerance and retirement for cause methods for life extension and safe operation of numerous commercial and military aircraft, particularly in locations where the high cost of inspection is associated with disassembly and surface preparation. This capability can also be used to make damage standards having known flaws, including representative crack clusters. In a second group of applications, scanning of inductive element arrays permit high-resolution wide-area imaging of the properties revealing quality, damage state, or spatial variations of properties of conductive and magnetic materials. Model-based inversion methods convert each sensing element response into property measurements and permit independent property and lift-off measurements with each element. Furthermore, new MWM sensors incorporating giant magnetoresistive sensors allow low frequency measurements, even down to dc. This permits inspection for hidden cracks or hidden corrosion in thick multilayer structures.

Paper Details

Date Published: 11 June 2002
PDF: 13 pages
Proc. SPIE 4702, Smart Nondestructive Evaluation for Health Monitoring of Structural and Biological Systems, (11 June 2002); doi: 10.1117/12.469911
Show Author Affiliations
Andrew P. Washabaugh, JENTEK Sensors, Inc. (United States)
Vladimir A. Zilberstein, JENTEK Sensors, Inc. (United States)
Darrell E. Schlicker, JENTEK Sensors, Inc. (United States)
Ian Shay, JENTEK Sensors, Inc. (United States)
David Grundy, JENTEK Sensors, Inc. (United States)
Neil J. Goldfine, JENTEK Sensors, Inc. (United States)

Published in SPIE Proceedings Vol. 4702:
Smart Nondestructive Evaluation for Health Monitoring of Structural and Biological Systems
Tribikram Kundu, Editor(s)

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