Share Email Print

Proceedings Paper

High placement and leveling accuracy flip-chip assembly for MOEMS
Author(s): Christopher Quirke; Gilbert Lecarpentier
Format Member Price Non-Member Price
PDF $14.40 $18.00
cover GOOD NEWS! Your organization subscribes to the SPIE Digital Library. You may be able to download this paper for free. Check Access

Paper Abstract

MOEMS micromirror device technology is becoming more important in the effort to develop cost-effective nxn optical switches for next-generation fiber optic networks. Although there are a variety of fabrication and assembly methods available, most are complex and costly. Using established flip-chip assembly techniques to perform device transfer can greatly simplify the assembly process. For this project, a high-accuracy device bonder is proposed for transfer of optical micromirror devices from one substrate to another. The same technique can be applied to individual devices, or on the wafer level. A high-accuracy device bonder was used for placement and in-situ bonding. The device bonder is capable of achieving 1 μm post-bonding accuracy in x, y and z axes. Levelling accuracy on the order of microns for a 200mm wafer ensures that the optical paths are correctly aligned. In-situ bonding also ensures that the leveling accuracy is maintained for the final device. Prior methods which use the self-levelling effect of solder bumps in a mass reflow type of operation can result in an unacceptable shift in the parallelism, ruining the device’s optical performance. Using a high-accuracy device bonder, devices can be successfully transferred using a flip-chip method. The x, y and z placement is accurate to within 1 μm and even less in some cases. The 1 μm accuracy is sufficient to ensure that optical paths align to waveguides which are subsequently used to align to a 9 μm singlemode fiber core. This method of MOEMS transfer reduces the complexity of the transfer process. Use of existing flip-chip placement and bonding techniques speeds the development cycles of MOEMS devices. The flip-chip assembly method is a cost effective and simple method for transfer of MOEMS devices. This method is enabled by a high-accuracy device bonder which is used for 1 μm accuracy placement and in-situ bonding.

Paper Details

Date Published: 13 November 2002
PDF: 6 pages
Proc. SPIE 4936, Nano- and Microtechnology: Materials, Processes, Packaging, and Systems, (13 November 2002); doi: 10.1117/12.469670
Show Author Affiliations
Christopher Quirke, SUSS MicroTec Co., Ltd. (Taiwan)
Gilbert Lecarpentier, SUSS MicroTec S.A. (France)

Published in SPIE Proceedings Vol. 4936:
Nano- and Microtechnology: Materials, Processes, Packaging, and Systems
Dinesh K. Sood; Ajay P. Malshe; Ryutaro Maeda, Editor(s)

© SPIE. Terms of Use
Back to Top