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Proceedings Paper

Novel fabrication method for 3D microstructures using surface-activated bonding and its application to micromechanical parts
Author(s): Takayuki Yamada; Mutsuya Takahashi; Takashi Ozawa; Satoshi Tawara; Takayuki Goto
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Paper Abstract

The purpose of this work is to demonstrate that a novel fabrication method for 3-D microstructures (FORMULA) is applicable to fabrication of micro mechanical parts with a large flexibility. This method is a kind of layer manufacturing method of thin films for metallic or dielectric microstructures using surface-activated bonding (SAB). The bonding interfaces of thin films are investigated by transmission electron microscope (TEM). Voids were observed at the interfaces of both pure aluminum films and Al-Cu alloy films. The ratio of void on the Al-Cu/Al-Cu interface is much larger than that of Al/Al interface, although the films have the same surface roughness of 3nm in Ra (average roughness). And approximately 10nm-thick amorphous intermediate layers were found at the interfaces. Furthermore, we have fabricated a micro gear of 900μm in diameter and 200μm in height, which is about ten times as large as our previous test pieces. Overhung structures such as a bridge structure and a cantilever were also fabricated without supporting layers beneath them.

Paper Details

Date Published: 13 November 2002
PDF: 8 pages
Proc. SPIE 4936, Nano- and Microtechnology: Materials, Processes, Packaging, and Systems, (13 November 2002); doi: 10.1117/12.469668
Show Author Affiliations
Takayuki Yamada, Fuji Xerox Co., Ltd. (Japan)
Mutsuya Takahashi, Fuji Xerox Co., Ltd. (Japan)
Takashi Ozawa, Fuji Xerox Co., Ltd. (Japan)
Satoshi Tawara, Mitsubishi Heavy Industries, Ltd. (Japan)
Takayuki Goto, Mitsubishi Heavy Industries, Ltd. (Japan)

Published in SPIE Proceedings Vol. 4936:
Nano- and Microtechnology: Materials, Processes, Packaging, and Systems
Dinesh K. Sood; Ajay P. Malshe; Ryutaro Maeda, Editor(s)

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