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Proceedings Paper

Nondestructive evaluation of bonding characteristics of TiO2-Al2O3 gas sensor
Author(s): Bin Feng; Golam Newaz; Gregory W. Auner; Sheikh Akbar; A. Merhaba
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Paper Abstract

Ceramic sensor based on TiO2-Al2O3 systems were thermally cycled in the temperature range of 21 degree(s)C to 685 degree(s)C for different number of cycles. Thermal wave imaging technique (TWI), a non-destructive and non-contact evaluation method was used to characterize the bonding of sensor films with the substrate. Based on the thermal wave signal amplitudes, an assessment of bond strength was made. The results indicate that samples with 700 degree(s)C heat treatment show the best bonding characteristics. Furthermore, with increasing number of thermal cycles, bonding quality turns out to decrease as damage occurs. Thermal wave imaging is a powerful NDE tool. Results from a number of material evaluation efforts indicate that the technique has great promise.

Paper Details

Date Published: 7 June 2002
PDF: 6 pages
Proc. SPIE 4703, Nondestructive Evaluation and Reliability of Micro- and Nanomaterial Systems, (7 June 2002); doi: 10.1117/12.469628
Show Author Affiliations
Bin Feng, Wayne State Univ. (United States)
Golam Newaz, Wayne State Univ. (United States)
Gregory W. Auner, Wayne State Univ. (United States)
Sheikh Akbar, The Ohio State Univ. (United States)
A. Merhaba, The Ohio State Univ. (United States)


Published in SPIE Proceedings Vol. 4703:
Nondestructive Evaluation and Reliability of Micro- and Nanomaterial Systems
Norbert Meyendorf; George Y. Baaklini; Bernd Michel, Editor(s)

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