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Proceedings Paper

Micro- and nano-DAC: a powerful technique for nondestructive microcrack evaluation
Author(s): Bernd Michel; Dietmar Vogel
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Paper Abstract

Recent advances in microelectronics and electronic packaging technology have led to a strong need in strain and stress analysis on micro and nano scale as well. Smallest cracks, delaminations and defects are a concern and can initiate defect propagation and can also cause failure of whole components. Crack detection and evaluation for crack lengths of very small microcracks are required. The authors present an approach to deformation measurement based on local correlation analysis on captured micrographs. Incremental displacement and strain fields are extracted from SEM and AFM images picked up for different object loading states. The application of the method is demonstrated by investigations of electronic packages. Fracture mechanics has been applied to combine the experimental results with advanced fracture and reliability concepts. Displacement fields in the immediate vicinity of micro and nano crack tips and crack opening displacements as small as some nanometers have been measured. They are used to determine fracture parameters. The results have also been used as input parameters in parametrized finite element simulation.

Paper Details

Date Published: 7 June 2002
PDF: 5 pages
Proc. SPIE 4703, Nondestructive Evaluation and Reliability of Micro- and Nanomaterial Systems, (7 June 2002); doi: 10.1117/12.469623
Show Author Affiliations
Bernd Michel, Fraunhofer Institute IZM Berlin (Germany)
Dietmar Vogel, Fraunhofer Institute IZM Berlin (Germany)


Published in SPIE Proceedings Vol. 4703:
Nondestructive Evaluation and Reliability of Micro- and Nanomaterial Systems
Norbert Meyendorf; George Y. Baaklini; Bernd Michel, Editor(s)

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